(Bloomberg) -- Ibiden Co., the dominant supplier of chip package substrates used in Nvidia Corp.’s cutting-edge semiconductors, may need to dial up the pace of production capacity increases to ...

The Japanese manufacturer currently dominates the market for sophisticated chip package substrates used in AI semiconductors and is a key supplier to several tech giants. Analysts tracking the ...

Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of ...

These "bumps" or "balls" are soldered onto the package substrate or the circuit board itself and underfilled with epoxy. The flip chip allows for a large number of interconnects with shorter ...

Competition for an early lead in glass substrates for computer chip manufacturing is heating up, with component firms projecting that the commercialization of this so-called "next-generation ...

Chiplet design engineers have complex new considerations compared to PCB concepts. Maintaining the quality and reliability of ...

ASU's new R&D facility is a key component of America's plan to bolster semiconductors and high-tech manufacturing.

The company makes a glass substrate that will be used to package computer chips together, which are used to power everything from smartphones to supercomputers. The $175 million in federal funding ...

The Synopsys 3DIC Compiler solution provides a unified chip-package co-design and analysis environment for creating an optimal 2.5D/3D multi-die system in a package. The solution includes features ...