The resurgence of the flip form factor has now turned out to be not just a technology flick but a real new smartphone niche. Flexible screens made it possible for phone manufacturers to resurrect the ...

There's nothing set in stone about the iPhone Flip right now, but the volume of rumors we've heard make it clear that it's something Apple wants to make. But Apple seems to be quietly working on a ...

Nevertheless, the Galaxy Z Flip 6 improved on the camera aspect and introduced a ... We expect stellar performance from the Exynos 2500 chip, and it should deliver enough power for simple tasks like ...

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Yangtze Memory Technologies Corporation (YMTC), China’s leading flash memory chip manufacturer, has achieved a significant technological breakthrough despite US sanctions, amid Beijing’s push ...

Google's new Willow quantum chip has broken new ground in an important random circuit sampling ... [+] benchmark, an important development in Google's roadmap for fault-tolerant quantum computing.

Samsung didn't use in-house Exynos chipsets in the Galaxy S25 series Next flagship Exynos chip could end up in the Galaxy Z Flip 7 A tipster has posted the specifications of the Exynos 2500 on X ...

TAIPEI -- Taiwan's government on Tuesday insisted that semiconductor cooperation with the U.S. is a "win-win" proposition, after President Donald Trump lobbed a new threat to impose chip tariffs ...

Chip manufacturing efforts in the US are less developed and more expensive than those in Taiwan. The threat of tariffs risks a double blow for Nvidia, one of TSMC's largest customers. On Monday ...

The 6.7-inch display of the Galaxy Z Flip 3 bends around the horizontal axis and has a small 1.9-inch screen on the outside for date/time/notification purposes. Under the hood, the phone offers ...

Taiwan emphasises complementarity in semiconductor trade with US Taiwan is home to world's largest contact chipmaker, TSMC TSMC is investing $65 bln in US state of Arizona TAIPEI, Jan 28 (Reuters ...

MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing ... MRSI Mycronic proudly introduces ...