E&R (E&R Engineering Corp.), a Taiwan-based semiconductor equipment manufacturer with 30 years of expertise, has supplied over 500 advanced semiconductor packaging tools to major OSATs worldwide, ...

YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With ...

SPRINGFIELD, TN – Phil Zarrow, President of ITM Consulting, is pleased to announce that Tom Zanatta has joined the firm as Principal Consultant.

The Food and Drug Administration just raised its recall of Lay’s Classic Potato Chips to the highest risk level. On Dec. 16, Frito-Lay issued a recall for 6,344 (13-ounce) bags of Lay’s ...

The top level of metalization is then used to connect the I/O circuitry itself to the flip chip pads. The pads are, in turn, connected to the package through a solder ball in much the same way that a ...

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect ... Figure 1: Typical Ball Grid Array Package (from Chip Scale Review) The top-down view of ...

While the margin decline stands out, it is encouraging that sales of multilayer ceramic capacitors for automobiles and flip-chip ball grid array, or FC-BGA, packages for servers increased ...

India's work on artificial intelligence (AI) has three main objectives that will be completed this year, Union Minister Ashwini Vaishnaw told NDTV at the World Economic Forum (WEF) meeting in Davos.

The fourth-generation iPhone SE will be equipped with a chip that has an identifier of T8140, according to a private account on social media platform X. That identifier is used by both the A18 and ...

It was so much better that the 8th grade lacrosse goalie made the radical choice to get a flip phone, giving him the ability to communicate without all the smart features — and distractions.

Rosencrance has over 30 years experience as an investigative reporter, writing for many newspapers in… These changes are bringing better chip designs, new materials, and smarter ways to make them.

DJI has rolled out its latest innovation, the DJI Flip. It is a compact and portable all-in-one vlog camera drone designed for vloggers and aerial photographers to offer safe flying and enhanced ...