Summary Fraunhofer’s “White House of Microelectronics Packaging” in Dresden has led 3D integration research for 15 years. It pioneered Cu TSV, wafer-level packaging, and AI-driven chiplet technology.
Semiconductor Packaging Market 2030 Semiconductor Packaging Market Expected to Reach $60.44 Billion by 2030 IoT products like senso ...
Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly implemented new shipment restrictions on Chinese IC design ...
Focusses on Advanced IC-Substrates and Next Generation Wafer-Level Packaging ...
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