BOE, a leading Chinese maker of LCD and OLED displays, is looking to make glass core substrates for next-generation domestic processors, Nikkei reports. The company plans to launch a pilot ...

TASMIT Inc. has released a new inspection system for glass substrates as part of its INSPECTRA series of semiconductor wafer visual inspection systems, which has received attention for its high ...

TASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer ...

Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due to the growing demand for generative AI, which has boosted..

and is compatible with glass core interposers and rewiring glass carriers, which are used in panel level packaging (PLP) and other applications. Semiconductor manufacturers have previously introduced ...