Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...

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Although named after the semiconductor packaging technique we are familiar with today, DEC Flip-Chips were introduced in 1964 as a modular electronics packaging system. These were used in many of ...

Defect inspection in flip chip microelectronic packaging is a critical area of research, particularly as the demand for smaller and more efficient electronic devices increases. Flip chip ...