Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding ... which are known to deteriorate laser performance and ...

Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...

Imec has demonstrated electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully ... heterogeneous integration solutions, such as flip-chip, micro-transfer printing or ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding ... which are known to deteriorate laser performance and reliability.