LG Innotek has begun the mass production of flip chip ball grid array (FC-BGA), its new semiconductor substrate targeting tech firms in the United States. “We have begun mass production of FC ...

YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With ...

Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...

LG Innotek, South Korea’s leading camera module maker, has started the mass production of flip-chip ball-grid array ... The global FC-BGA market is expected to double from $8 billion in 2022 ...

Research Institute Lee Chang-min noted, "The continued strong demand for multilayer ceramic capacitors (MLCC) and flip-chip ball grid arrays (FC-BGA) centered around artificial intelligence (AI ...