The Japanese manufacturer currently dominates the market for sophisticated chip package substrates used in AI semiconductors and is a key supplier to several tech giants. Analysts tracking the ...

(Bloomberg) -- Ibiden Co., the dominant supplier of chip package substrates used in Nvidia Corp.’s cutting-edge semiconductors, may need to dial up the pace of production capacity increases to ...

Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of ...

The company makes a glass substrate that will be used to package computer chips together, which are used to power everything from smartphones to supercomputers. The $175 million in federal funding ...

These "bumps" or "balls" are soldered onto the package substrate or the circuit board itself and underfilled with epoxy. The flip chip allows for a large number of interconnects with shorter ...

This methodology, called SWAN, generates a simulation model for the complete digital part, which comprises the package as well as a ... Extraction of the switching events: a substrate simulation model ...

ASU's new R&D facility is a key component of America's plan to bolster semiconductors and high-tech manufacturing.

This news comes from the Korean news outlet ET News and should be viewed with some skepticism since much of it is based on an unofficial ...

Competition for an early lead in glass substrates for computer chip manufacturing is heating up, with component firms projecting that the commercialization of this so-called "next-generation ...