And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?
The temperature is controlled via USB by a computer, allowing [Edmar] to set a temperature profile as recommended by the BGA chip’s data sheet. Right now, removing a BGA chip works great ...
Laptop vendors don't buy as many of those CPUs as AMD would like, and they start to filter into the market via alternative channels—like these Minisforum "Mobile on Desktop" (MoDT) products. So it ...
Reballing und Löten von BGA-Chips Ein Angstgegner vieler Maker sind ICs in BGA-Bauform – und erst recht, wenn sie ausgelötet und wiederverwendet werden sollen: Die Ball Grid Arrays sind zwar ...
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